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Chao-Kun Hu

 

hu

IBM
Si Technology Department
IBM T. J. Watson Research Ctr
P.O. Box 218
Yorktown Heights, NY 10598
Phone: +1 914 945 2378
    Fax: +1 914 945 2141

E-mail:

haohu@us.ibm.com

 

Dr. Chao-Kun Hu is a Research Staff Member in the Reliability and Materials Sciences Department at the Thomas J. Watson Research Center of IBM. He received his Ph.D. degree in physics from Brandeis University in 1979.  He was a research associate at Rensselaer Polytechnic Institute before he joined IBM in 1984.  He was involved in the development of multilevel on-chip Cu and Al(Cu) interconnections fabrications at the IBM Yorktown Silicon Facility. His current research is in the area of on-chip interconnections electromigration reliability. He received IBM Research Division Award for the first demonstration of integration of Cu-polyimide wiring on silicon IC chips in 1991. He was one of the recipients of IBM Outstanding Technical Achievement Award in 1998, IBM Corporate Awards in 1999 and 2006 in appreciation for his contributions in Copper Interconnect Technology and Invention of The Year 2006 by NY Intellectual Property Law Association.