Paul S. Ho



University Texas at Austin
Center for Materials Science and Engineering
Prc Intercon & Pkg Grp
MS R8650
Austin TX 78712
Phone: +1 512 471 8961
    Fax: +1 512 471 8969

Paul S. Ho is the Director of the Laboratory for Interconnect and Packaging at the University of Texas at Austin. He received his B.S. degree in mechanical engineering from National Chengkung University, Taiwan, M.S. degree in physics from National Tsinghua University, Taiwan and Ph.D. degree in physics from Rensselaer Polytechnic Institute. He joined the Materials Science and Engineering Department at Cornell University in 1966 and became an Associate Professor in 1972. In 1972, he joined the IBM T.J. Watson Research Center and became Senior Manager of the Interface Science Department in 1985. In 1991, he joined the faculty at the University of Texas at Austin and was appointed the Cockrell Family Regents Chair in Materials Science and Engineering.  His current research is in the areas of materials science, processing and reliability for interconnect and packaging for microelectronics. He received the Outstanding Alumni Achievement Award from National Chengkung University in 1992, the Rensselaer Alumni Fellow Award from Rennselaer Polytechnic Institute in 1994, the Michel Lerme Award from the International Interconnect Technology Conference in 1999, The Callinan Award from the Electrochemical Society in 2000 and the University Research Award from the Semiconductor Industry Association in 2007.  He holds the inventorship of 15 U.S. Patents in microelectronics technology. He has edited several books and published extensively in the area of thin films and materials science for microelectronics.  He is a Fellow of the American Physical Society, the American Vacuum Society and the Institute of Electrical and Electronics Engineering.