Lastest Issue: Table of Contents (TOC)
Below is the complete Table of Contents for the current edition of J-MEMS. Click an article title to view within IEEE Xplore.
- Front Cover
- Journal of Microelectromechanical Systems
- Fabrication of a Novel GaAs Thermopile Sensor for RF Amplitude Demodulation
- Employing Stencil-Assisted Laser Ablation to Simplify the Fabrication of Polymer Membrane-Suspended Microstructures on Printed Circuit Boards
- Real-Time Phase Compensation for Scale Factor Nonlinearity Improvement Over Temperature Variations for MEMS Gyroscope
- Temperature Dependence Modeling and Thermal Sensitivity Reduction of Bulk Micromachined Silicon MEMS Lamé Resonators
- Toward Band n78 Shear Bulk Acoustic Resonators Using Crystalline Y-Cut Lithium Niobate Films With Spurious Suppression
- Phononic Frequency Combs in Atomically Thin Nanoelectromechanical Resonators Via 1:1 and 2:1 Internal Resonances
- High-Performance, Low-Cost On-Chip Fabry-Perot Interferometer With Microfluidic Channel Using Single Anisotropic Wet Etching
- High-Aspect-Ratio Thin-Film Stiffening Structures Made of Atomic-Layer-Deposited Alumina and Its Application to a Scanning Micromirror
- Atomization of High Viscous Liquids Using a MEMS Vibrating Mesh With Integrated Microheater
- A Zeolitic Imidazolate Framework-8-Coated Coupled Resonant Gas Sensor
- Origami-Inspired Fabrication of High-Performance Wafer-Level Packaged Three-Dimensional Radio-Frequency Inductors
- Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal
- Transmission Target for a MEMS X-Ray Source
- A Thin Film Porous Alumina Vacuum Package Utilizing a Pore Sealing Getter
- TechRxiv: Share Your Preprint Research with the World!
- Table of Contents
