Lastest Issue: Table of Contents (TOC)
Below is the complete Table of Contents for the current edition of J-MEMS. Click an article title to view within IEEE Xplore.
- Front Cover
- Journal of Microelectromechanical Systems
- Direct Growth and Fabrication of Tungsten Coated GaN Nanowire Probes on Cantilevers for Scanning Probe Microscopy
- A High-Speed Chip-Scale Rotary Polygon Optical Scanner Based on a Micromotor Integrated With a Micro-Polyhedron Mirror
- CMOS-Integrated Aluminum Nitride MEMS: A Review
- Accurate Identification of the Evolution of MEMS Resonant Accelerometer Residual Stresses at the Wafer-Die-Chip Level
- Fused Quartz Dual-Shell Resonator Gyroscope
- Modeling and Analysis of a MEMS Vibrating Ring Gyroscope Subject to Imperfections
- A 5.3 GHz Al0.76Sc0.24N Two-Dimensional Resonant Rods Resonator With a kt2 of 23.9
- Optimization of Anchor Placement in TPoS MEMS Resonators: Modeling and Experimental Validation
- Bistability in Coupled Opto-Thermal Micro-Oscillators
- Multidegree-of-Freedom State-Space Modeling of Nonlinear Pull-in Dynamics of an Electrostatic MEMS Microphone
- Exploring Ru Compatibility With Al-Ge Eutectic Wafer Bonding
- Controlling Residual Stress and Suppression of Anomalous Grains in Aluminum Scandium Nitride Films Grown Directly on Silicon
- Performance of MEMS-Based Monopropellant Microthruster With Insulating Effect
- Micro-Patterning of Electret Charge Distribution by Selective Liquid-Solid Contact Electrification
- Three-Degree-of-Freedom Electromagnetic Microactuator With Powder-Based Sm-Fe-N Magnets and Parylene Beams
- A Suspended Metamaterial Mirror for Hyperspectral Shortwave Infrared Fabry-Perot Filters
- Experimental Investigation of Moisture Induced Offset Drifts on Plastic Packaged MEMS Sensor Devices
- Ultrahigh-Sensitivity Piezoelectric AlN MEMS Speakers Enabled by Analytical Expressions
- Evaluation of Polymer Materials for MEMS Microphones
- A Bulk-Type High-Pressure MEMS Pressure Sensor With Dual-Cavity Induced Mechanical Amplification
- A Closed-Loop System for Resonant MEMS Sensors Subject to Blue-Sideband Excitation
- Characterization of a Wafer-Level Packaged AuRu/AlCu Contact for Micro-Switches
- On-Chip Generation Method of Shock Load and Characterization of Microstructure Shock Process
- Member ad suite
- TechRxiv: Share Your Preprint Research with the World!
- Table of Contents
