T-SM Table of Contents
Below is the complete Table of Contents for the current edition of T-SM. Click an article title to view within IEEE Xplore.
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- Table of contents
- IEEE Transactions on Semiconductor Manufacturing publication information
- Self-Reference-Based Hardware Trojan Detection
- Gaussian Process Regression for Virtual Metrology-Enabled Run-to-Run Control in Semiconductor Manufacturing
- Development of a TEM Compatible Nanowire Characterization Platform With Self-Forming Contacts
- Hybrid Particle Swarm Optimization Combined With Genetic Operators for Flexible Job-Shop Scheduling Under Uncertain Processing Time for Semiconductor Manufacturing
- Line Balancing Strategy for Re-Entrant Manufacturing
- Scheduling of Dual Resource Constrained Lithography Production: Using CP and MIP/CP
- Heuristic Algorithm for a WIP Projection Problem at Finite Capacity in Semiconductor Manufacturing
- An Integrated Approach for IC Design RD Portfolio Decision and Project Scheduling and a Case Study
- Effect of a Trap Zone in Reducing Nanoparticle Contamination of Wafers and Photomasks in Parallel Airflowp
- Dynamics Model and Vibration Control of Piezoelectric Feeder in Semiconductor Manufacturing Assembly
- Moisture Prevention in a Pre-Purged Front-Opening Unified Pod (FOUP) During Door Opening in a Mini-Environment
- Transfer-Learning-Based Online Mura Defect Classification
- Novel Addressable Test Structure for Detecting Soft Failure of Resistive Elements When Developing Manufacturing Procedures
- An Optimal Design Methodology for Yield-Improved and Low-Power Pipelined ADC
- Compact Analytical Model to Extract Write Static Noise Margin (WSNM) for SRAM Cell at 45-nm and 65-nm Nodes
- Detection of Bond Pad Discolorations at Outgoing Wafer Inspections
- On Effectiveness of Transfer Learning Approach for Neural Network-Based Virtual Metrology Modeling
- Clustering the Dominant Defective Patterns in Semiconductor Wafer Maps
- Real-Time Electrical Characteristics of Microprobe Testing Process in Microelectronics Packaging
- A Data Driven Cycle Time Prediction With Feature Selection in a Semiconductor Wafer Fabrication System
- A Multi-Time-Step Finite Element Algorithm for 3-D Simulation of Coupled Drift-Diffusion Reaction Process in Total Ionizing Dose Effect
- Introducing IEEE Collabratec
- Imagine a community hopeful for the future
- Together, we are advancing technology
- IEEE Transactions on Semiconductor Manufacturing information for authors