Since 1963, IEEE has acknowledged those individuals who have contributed to the advancement of engineering science and technology. The honor of Fellow is bestowed on the recipient who has had an extraordinary record of accomplishments in any of the IEEE fields of interest. To learn more about the IEEE Fellow Program: https://www.ieee.org/membership/fellows/index.html. Congratulations to the 27 EDS members elected to IEEE Grade of Fellow in 2024. 

 

Massood Zandi Atashbar 

for contributions to flexible hybrid electronics

 

Joseph Bardin 

for contributions to cryogenic microwave circuits

 

Premjeet Chahal

for contributions to additive manufacturing and materials characterization

 

Ke-horng Chen 

for contributions to power management integrated circuits and system design

 

Srabanti Chowdhury

for contributions to wide bandgap semiconductor devices and technology

 

Dirk Englund 

for contributions to semiconductor quantum photonics and machine learning

 

Oliver Faynot

for leadership in CMOS technology development

 

Aaron Franklin

for contributions to transistor scaling and carbon nanotubes applications in electronics

 

Sergiu Goma 

for contributions to hardware implementation of image processing for color cameras in mobile phones

 

Thomas Hall

for leadership in engineering technology education

 

Francesca Iacopi

for contributions to integration strategies of nanomaterials in silicon technologies

 

Debdeep Jena

for contributions to distributed polarization doping in the III-V semiconductor family

 

Mario Lanza

for contributions to nanoelectronics metrology of ultra-scaled materials and devices

 

Di Liang 

for contributions to photonic integration in optical communication, computing, and volume production

 

Marko Loncar  

for contributions to thin film lithium nanophotonics

 

Ionut Radu

for contributions to silicon-on-insulator materials for semiconductor devices

 

Li Ran 

for contributions to the modeling of power electronic devices

 

Michael Ropp

for contributions to distributed energy resources integration in power systems

 

Atif Shamim 

for contributions in the field of antenna-on-chip and antenna-in-package

 

Volker Sorger 

for contributions to the optoelectronic devices and photonicelectronic ASICs

 

Vladimir Stojanovic 

for contributions to electronic-photonic design and system-onchip integration

 

Yukiharu Uraoka

for contributions to reliability evaluation technology for thin film devices

 

Alberto Valdes-garcia

for contributions to millimeter-wave circuits and systems for communications

 

Barry Bing-ruey Wu

for contributions to enhancement and commercialization of InPbased ultra-high-speed DHBT IC technology

 

John Yeow 

for contributions to the understanding and applications of nanostructures and nanocomposites

 

Shimeng Yu

for contributions to non-volatile memories and in-memory computing

 

Jim Zheng 

for contributions to energy storage technologies

 

 

 

EDS Award Presentation - IEDM 2023

 

IEEE EDS Fellows Recognized at IEDM 2023

 

 

2023

Stephen C. Terry

John H. Jerman

James B. Angell (late)

Palo Alto, CA

For pioneering contributions to MEMS by developing and commercializing the microfabricated gas chromatograph
2022
Göran Stemme

Royal Institute of Technology
Stockholm Sweden

For pioneering contributions in MEMS sensors, particularly for medical applications, and sustained commitment to transferring MEMS to industry and society
2021
Chang-Jin "CJ" Kim Univ. of California, Los Angeles, CA For pioneering surface-tension-based microelectromechanical systems (MEMS) that led to electrowetting digital microfluidics and superhydrophobic drag reduction
2020
Ming C. Wu University of California, Berkeley For pioneering contributions in MEMS optical switches and optoelectronic tweezers
2019
Hiroyuki Fujita Advanced Research Lab of Canon Medical Systems Corp. For pioneering contributions in microactuators, optical-MEMS, and bio-nano-MEMS and strong leadership in the science of MEMS
2018
Pasqualina M. Sarro

Delft University of Technology

For pioneering contributions in novel materials, material integration and innovations in MEMS and strong commitment to education and technology transfer

2017
Clark Nguyen

University of California, Berkeley
Berkeley, CA, USA

For pioneering research on high-frequency MEMS vibrating systems and for extraordinary efforts in support of MEMS in industry, government, and teaching

2016

 

Henry Baltes

Acceptance Speech

Presentation Photo

ETH Zurich, Zurich, Switzerland

For contributions to the exploration and development of CMOS-MEMS, to production using IC foundries and MEMS post-processing, and for inspirational leadership in the worldwide MEMS community
2015
Roger T. Howe
Stanford University
Stanford, CA, USA
For sustained contributions to MEMS/NEMS over many years especially those enabling MEMS-based inertial-sensor applications
Yu-Chong Tai

Caltech, Pasadena, CA, USA

For pioneering contributions in materials, technologies, and design of MEMS/NEMS and groundbreaking achievements in the realization of biomedical parylene MEMS

 

 

 

2022 Girish Pahwa University of California (UC) Berkeley
2021

Avirup Dasgupta

Jiaju Ma

Indian Institute of Technology Roorkee

Gigajot Technology

2020

Harshit Agarwal

Max Shulaker

Indian Institute of Technology, Jodhpur, India

Massachusetts Institute of Technology, Cambridge, MA, USA

2019

Luisa Petti
Qianqian Huang
Pragya Kushwaha

Free University of Bolzano, Bolzano, Italy
Peking University, Beijing, China
University of California, Berkeley, CA, USA
2018 Lukas Czornomaz
Manan Suri
IBM, Zurich, Switzerland
Indian Institute of Technology, Delhi, India
2017 Dongil Moon
Shimeng Yu
NASA Ames Research Center, CA, USA
Arizona State University, AZ, USA
2016 Nagarajan Raghavan SUTD Singapore University of Technology & Design, Singapore
2015 Mayank Shrivastava Indian Institute of Science, Bangalore
2014 Can Bayram University of Illinois at Urbana-Champaign
2013 Runsheng Wang Peking University, Beijing, China
2012 Jin-Woo Han NASA Ames Research Center, Moffett Field, CA, USA
2011

Mina Rais-Zadeh

Ravi Todi

University of Michigan, Ann Arbor MI, USA

Western Digital Technologies, Foundry Technology Development, Milpitas, CA, USA

2010 Chen Yang University of California, Berkeley, CA, USA
2009 Chi On Chui University of California, Los Angeles, CA, USA