Transactions on Materials for Electron Devices

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“Device innovation has never been more dependent on novel materials. This Journal brings academics and industrial scientists together to truly validate if, how and which novel materials could become a solution for current and future challenges in electron devices.”





The IEEE Transactions on Materials for Electron Devices (T-MAT) publishes contributed and invited articles of different formats in the field of materials for electron devices and their interconnects.  The focus of T-Mat is on the applied aspects of electronic materials, as well as fundamentals directly relevant to individual and integrated device engineering and fabrication.


Materials will include advanced thin-films and their interfaces, as well as nanomaterials (nanowires, nanotubes, 2D materials and their combination). Manufacturing platforms will include wafer-level, roll-to-roll as well as direct-write and additive technologies. Processing techniques will also be incorporated that can hone materials’ properties to an optimal performance for designated applications. Aspects of interest also include advances in scalability, large-scale structuring and patterning, robustness and control of interfaces, integrated performance and reliability, and related novel metrics, while keeping an eye out for long-term sustainability of large-scale deployment in semiconductor manufacturing.


Editorial Board

Prof. Francesca Iacopi, Editor-in-Chief, University of Technology Sydney, Australia

Prof. Paul Berger, Ohio State University, OH, USA

Prof. Ehrenfried Zschech, deepXscan GmbH and Technical University Dresden, Germany

Prof. Pavel Mokrý, Technical University of Liberec and Czech Academy of Sciences, Czech Republic

Dr. Marko Radosavljevic, Intel, OR, USA

Dr. Ricardo Donaton, IBM Research, NY, USA

Prof. Sumeet Walia, Royal Melbourne University of Technology, Australia

Dr. Evgeniya Lock, Naval Research Laboratory, DC, USA

Dr. Yang Yang, University of Technology Sydney, Australia

Prof. Junichi Koike, Tohoku University, Japan

Dr. Ahmad Islam, Air Force Research Laboratory, OH, USA

Prof. Andrea Ferrari, Cambridge University, UK

Prof. Yunlong Li, Zhejiang University, China

Dr. Susthita Menon, IMEM, University Kebangsaan, Malaysia

Dr. Sylvain Maîtrejean, CEA-Leti, France

Prof. Philip Feng, University of Florida, USA

Dr. Chong Leong Gan, Micron Technology Inc., Taiwan


 Financial Sponsor



Technical Sponsor