Editorial Board

Paul R. Berger

Ohio State University, Department of Electrical and Computer Engineering, Columbus, Ohio, USA

Tampere University, Department of Electronics and Communications Engineering, Printed and Organic Electronics Group, Tampere, Finland

Lecture Topics:

• Si-based Resonant Interband Tunnel Diodes for Quantum Functional and Multi-level Circuitry (Mixed-Signal, Logic, and Low Power Embedded Memory) to Extend CMOS
• Organic Photovoltaics: An Introduction to OPV plus Plasmonic enhancements (i.e. point-of-use energy harvesting, conformable to flexible and curved surfaces)
• Passive Millimeter Wave Imaging for Security and Safety via Si-based Backward Diode Sensors (i.e. detect concealed weapons and airplane safety for sight through fog, smoke and light rain)
• Fully Printed Flexible Internet-of-Things Nodes with Energy Scavenging and Non-toxic Energy Storage
• Nitride-Based Resonant Tunneling Structures for Terahertz Gain
• Unipolar-doped Co-Tunneling Structures: A new pathway for efficient light emission without P-type doping
• Solar-Powered Humanitarian Engineering: Tanzania, Colombia & USA

Paul R. Berger (S’84 M’91 SM’97 F’11) is a Professor in Electrical & Computer Engineering at Ohio State University and Physics (by Courtesy). He is also a Distinguished Visiting Professor at Tampere University in Finland. He received the B.S.E. in engineering physics, and the M.S.E. and Ph.D. (1990) in electrical engineering, respectively, all from the University of Michigan, Ann Arbor. Currently, Dr. Berger is actively working on quantum tunneling devices, printable semiconductor devices & circuits for IoT, bioelectronics, novel devices, novel semiconductors and applied physics.

Formerly, he worked at Bell Laboratories, Murray Hill, NJ (1990-’92) and taught at the University of Delaware in Electrical and Computer Engineering (1992-2000). In 1999, Prof. Berger took a sabbatical leave while working first at the Max-Planck Institute for Polymer Research, Mainz, Germany and then moved on to Cambridge Display Technology, Ltd., Cambridge, United Kingdom. In 2008, Prof. Berger spent an extended sabbatical leave at IMEC (Interuniversity Microelectronics Center) in Leuven, Belgium while appointed as a Visiting Professor in the Department of Metallurgy and Materials Engineering, Katholieke Universiteit Leuven, Belgium. Prof. Berger was also a Finnish Distinguished Professor (FiDiPro) at Tampere University of Technology (2014-2019), and he continues as a Fulbright-Nokia Distinguished Chair in Information and Communications Technologies (2020-2022) with the newly merged Tampere University.

He has authored over 240 referred publications and presentations with another ~100 plenary, keynote, invited talks, 5 book sections and been issued 25 patents with 3 more pending from 60+ disclosures with a Google Scholar H-index of 35. Some notable recognitions for Dr. Berger were an NSF CAREER Award (1996), a DARPA ULTRA Sustained Excellence Award (1998), Lumley Research Awards (2006, 2011), a Faculty Diversity Excellence Award (2009) and Outstanding Engineering Educator for State of Ohio (2014). He has been on the Program and Advisory Committees of numerous conferences, including the IEDM, DRC, ISDRS, EDTM and IFETC meetings. He will be hosting the IFETC in ’21 as General Chair. He currently is the Chair of the Columbus IEEE EDS/Photonics Chapter and Faculty Advisor to Ohio State’s IEEE Student Chapter. In addition, he is an elected member-at-large to the IEEE EDS Board of Governors (19’-21’), where he is also Vice Present of Strategic Directions (20’-21’) and a member of the EDS Finance Committee.

He is an IEEE EDS Fellow (2011) and Distinguished Lecturer (since 2011), as well as a Senior member of the Optical Society of America. He has received $9.9M in USA funding as lead PI, with an additional $26M as Co-PI in USA and €8.8M in funding through his Finnish partnerships. Altogether, he has received ~$47.5M in research funding.

Prof. Berger has established significant humanitarian engineering projects across the world with an emphasis on solar-power and sustainability. After completing a 6 year presence in Haiti to electrify remote schools with solar powered LED lighting as an Alternative Spring Break, Berger re-established two new international programs. (1) One through OSU’s Office of International Affairs, has traveled to Arusha, Tanzania with a group of engineering students from different majors to design, build and install a solar powered LED lighting system for an orphanage. (2) Additionally, through IEEE’s Humanitarian Activities Committee, Berger also proposed, and was funded, to provide solar-powered desalinization for the indigenous Wayúu peoples living in the Guajira peninsula desert. Also, the IEEE Electron Device Society has provided Berger additional funds to extend the Colombia project into 2020.

Philip Feng is currently a Professor of Electrical & Computer Engineering (ECE) and a member of Graduate Faculty in Physics at University of Florida, Gainesville, Florida, USA. His research is primarily focused on emerging semiconductor devices and micro/nanoelectromechanical systems (MEMS/NEMS), especially those based on 2D materials and their van der Waals heterostructures, advanced semiconductors and wide-bandgap materials, quantum devices, and their heterogeneous integration with mainstream integrated circuits and optical/photonic technologies. Feng received his Ph.D. in Electrical Engineering from California Institute of Technology (Caltech) in 2007. He was among the invited participants to the National Academy of Engineering (NAE) U.S. Frontiers of Engineering (USFOE) Symposium (2013) and was subsequently selected as a recipient of the NAE Grainger Foundation Frontiers of Engineering (FOE) Award (2014). Feng has also received the National Science Foundation CAREER Award (2015), the Presidential Early Career Award for Scientists and Engineers (PECASE 2019), and several Best Paper Awards (with his students) at IEEE and other international conferences. Feng has served on the Technical Program Committees (TPCs) for the IEEE IEDM, IEEE MEMS, Transducers, IEEE IFCS, IEEE SENSORS, and other international conferences. He served as a Track Chair for IEEE SENSORS 2016-2017, and as the TPC Group 4 Chair for IEEE IFCS 2018-2020. He was also the Technical Program Chair for the MEMS/NEMS Technical Group at the 61st to 63rd American Vacuum Society (AVS) International Symposium & Exhibition. Feng served as a Chair for the 34th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2021). He has also been a co-organizer and technical chair of the SiC Materials & Devices Workshops (since 2017).

Dr. Chong Leong, Gan received his B.S. degree in Chemical Engineering from National University of Malaysia in 2000, M.S. degree in Chemical Instrumentation in 2003 from University Science Malaysia, and Ph.D. in Nanoelectronic Engineering from University Malaysia Perlis, Malaysia in 2015. He is Senior Member of IEEE, Fellow of Institute of Materials, Minerals & Mining, UK, Fellow of Malaysian Institute of Chemistry, Fellow of Institute of Physics, UK and Royal Society of Chemistry, UK. Since 2000, he has been a Quality and Reliability MTS with Altera, Product Engineering Manager with Osram Opto-Semiconductors, Senior R&D Engineering Manager with Western Digital and currently working as Package Characterization Director with Micron Taiwan. He is recipient of IEEE EPS Distinguish Technical Leadership award in 2021, Emerald Outstanding Reviewer in 2021 and ASME JEP Reviewer of the Year in 2022. His research interests including semiconductor packaging reliability, electronic packaging materials characterization, nanomaterials, and radiation reliability. He has published more than 75 international journal articles, 1 book with Springer Publisher. CL serves as Editorial boards with more than 30 international journals and with 28 patents issued/ filing in US and China patent offices.

Dr. Ahmad Ehteshamul Islam is a Senior Electronics Engineer at the Air Force Research Laboratory (AFRL) - Sensors Directorate (RY). He serves as a Research Team Lead at the Devices for Sensing Branch (RYDD) developing microwave devices and amplifiers using III-N materials and high frequency power converters using Ga₂O₃. He is interested in the performance improvement and reliability of microelectronic devices by utilizing materials innovation, defect engineering, microfabrication, and novel device design.

Dr. Islam obtained bachelor’s in electrical engineering (EE) from Bangladesh University of Engineering and Technology (BUET) in 2004, and a Ph.D. in EE from Purdue University in 2010. His Ph.D. research was on the theory and characterization of Bias Temperature Instability; the resultant model is now widely adopted in the CMOS industry and has recently been included into a TCAD model developed by Synopsys. He has published journals and conference proceedings on dielectric integration, defect engineering, nanomaterials, flexible biosensors, and high-frequency, high-power and high temperature electronics. He is a Senior Member of IEEE and a member of IEEE EDS Education Activities Committee. He was the recipient of IEEE Dayton Section Harrell V. Noble award (2024), DoD Laboratory Scientist of the Quarter award for (Q4/2023), National Research Council (NRC) postdoctoral fellowship (2012, 2014), Intel foundation PhD fellowship (2009), IEEE EDS PhD fellowship (2008), and Kintar-Ul-Haque Gold Medal (2005).

Dr. Islam joined the United States Air Force in 2020 as a civil servant. Previously, he worked with AFRL/RYDT as a Research Engineer/Technical Advisor of KBR, Inc. (2019-2020), and with AFRL/RXAS as a Research Scientist of UES, Inc. (2012-2014, 2016-2019) and a NRC Postdoctoral Fellow (2014-2016). He also worked as Adjunct Faculty in EE at the University of Dayton (2019-2020), as a Postdoctoral Researcher with Prof. John Rogers at the University of Illinois (2010-2012) and as a Lecturer of EE Department at BUET (2004-2005).

Prof. Li Yunlong is a full professor and “Qiushi” Distinguished Professor at College of Integrated Circuits, Zhejiang University, China. He holds a Ph.D. in Electrical Engineering from KU Leuven, Belgium, and a bachelor’s and master’s degree from Tsinghua University, China. Prior to joining Zhejiang University, he was apportioned Principal Member of Technical Staff at imec Belgium, where he had been working for more than 20 years. He plays a pivotal role in coordinating and leading various research projects at the forefront of semiconductor science and technology, with his expertise lying in semiconductor unit process, process integration, and reliability. Prof. Li’s current research focuses on advanced CMOS BEOL technology and reliability, heterogeneous (chiplet) integration and reliability, and novel device/component integration development using CMOS compatible technologies.

Sylvain Maitrejean has been in the staff of CEA Leti (Grenoble, France) since 2000. Within the Nanoelectronic & Photonic Platform Division, after several management positions, he is now in charge of collaboration with key Leti partners.

Before joining Leti, he hold a master's degree in physics and material science at the Grenoble National Engineering School for Physics (ENSPG) in 1996. In 2000, he received a Ph.D. in physical metallurgy from the National Polytechnic Institute of Grenoble (Grenoble-INP).

Within Leti, he worked on different applications (CMOS, BEOL integration, Resistive Memories, PCM, Advanced Substrates and 3D Integration…). His main activities involved process integration and development of unit processes. From 2013 to 2015, he was a LETI assignee at IBM research (Nanotech Center, Albany NY, US) and conducted researches for FDSOI CMOS technologies, FinFet and stacked nanowires.

His major actual research field concerns material and integration processes for micro LED.

His background defines him as a material science & engineering person.

He is the author or co-author of over 100 publications in international journals and conferences. He serves in various international conference committees including MAM (Material for Advanced Metallization), SSDM conference (International Conference on Solid State Devices and Materials), IEEE IITC (International Interconnects Technology Conference) and IEEE IEDM (International Electron Device Meeting). 

P Susthitha Menon is currently an Associate Professor at the Universiti Kebangsaan Malaysia (UKM) at Kuala Lumpur. She received her BSEE degree from (UKM) in 1998. As an Intel scholar, she worked at Intel Malaysia as a Product Engineer for mobile modules systems from 1999 to 2002. She then received her MSc and PhD (Distinction) degrees in 2005 and 2008 respectively from UKM, for the development of Si- and InGaAs-based interdigitated p-i-n photodiodes. At the University’s Institute of Micro-Engineering & Nanoelectronics (IMEN) she is specializing in the field of optoelectronics, nanophotonics, and robust engineering optimization. Susthitha is a Senior Member of IEEE. She is in the organizing team international conference ICSE by ED Malaysia Chapter for many years and is the Secretary of the IEEE Electron Devices Malaysia Chapter.

Pavel Mokrý, born in November 1975, is an experienced professor and researcher with a strong background in materials science, semiconductor physics, and computational materials science. He earned his M.Sc. and Ph.D. degrees from the Technical University of Liberec in 1999 and 2001, respectively. His career includes significant roles such as Professor at the Institute of Mechatronics and Computer Engineering, Technical University of Liberec since 2016, and Senior Researcher at the Regional Center for Special Optics and Optoelectronic Systems, Institute of Plasma Physics of the Czech Academy of Sciences in Prague since 2011. Dr. Mokrý has been recognized with several awards, including the Werner von Siemens Excellence Awards in 1999 and 2000. He has also held major administrative positions, such as Vice-Rector for Science, Research, and Foreign Affairs at the Technical University of Liberec from 2018 to 2022.

Lecture Topics:

Advanced Logic Scaling Using Monolithic 3D Integration (2) Large-Scale Heterogeneous Device Integration

Marko Radosavljević received PhD in physics from University of Pennsylvania in 2001, followed by 2 years as a postdoc in the Physical Sciences Department at IBM T.J. Watson Research Center in New York. In 2003, he joined Components Research division of Intel Corporation in Oregon. Marko’s early external visibility has been in researching non-Si transistors, such as InP, InSb, GaN material families as well as carbon nanotubes for applications in logic, RF and power delivery. Since 2019, he is leading a monolithic 3D integration group, enabling new functionalities and providing ultimate transistor density improvements. He served IEEE/EDS community as editor of EDL and committee member for IEDM. He received 2 Intel Achievement Awards (highest technical award within the company, awarded annually), authored many research manuscripts (including IEDM paper of the decade from 2001-2010 and VLSI test of time paper awarded in 2022) and holds numerous granted US and international patents.

Sumeet is a Professor of Materials and electronics engineering at RMIT University in Melbourne. He leads a Centre that focuses on discovering and manipulating fundamental properties of materials for applications across energy, nano/optoelectronics, sensors and healthcare. He has a demonstrated track of creating bespoke, needs-based multidisciplinary teams to solve critical technological bottlenecks.

He has co-authored over 140 peer reviewed publications including authoritative reviews in prestigious journals, a named inventor on eleven patents and editor of two books for the CRC Press.

Sumeet partners with several cross-sector industry to translate fundamental discoveries into the real world. He is also an avid contributor in enhancing Equity, Diversity, Inclusion and Access in STEM.

He currently chairs the national equity, diversity and inclusion committee of Science and Technology Australia and is part of advisory boards of the Victorian government and the Australian Academy of Technology and Engineering.

His scientific and leadership contributions have been recognised through several national and international awards including the Eureka Prize for Science leadership and the MIT Technology Review's Top 10 Innovators in APAC.

Yang Yang (IEEE Senior Member) was born in Bayan Nur, Inner Mongolia, China and received a PhD degree in Electronic Engineering from the Department of Electrical and Computer Systems Engineering, Monash University, Clayton, Australia, in 2013.

Dr Yang was with the State Key Laboratory of Terahertz and Millimeter Waves, City University of Hong Kong, in 2016. In December 2016, he joined the University of Technology Sydney (UTS), Australia. He is currently an Associate Professor and a Group Leader of 3D Millimetre-Wave and Terahertz Circuits and Antennas in UTS Tech Lab. His research interests include emerging RF materials and additive manufacturing techniques for 3D millimetre-wave and terahertz device designs for 5G, CubeSat and biomedical applications. He has over 240 international publications in microwave, millimetre-wave and terahertz circuits and antennas. In 2022, Dr Yang received the Linkage Infrastructure, Equipment and Facilities (LIEF) Award funded by the Australian Research Council to establish the national laboratory of the Australian 3D Terahertz Beam Measurement Platform (500 GHz). Dr Yang is a current Associate Editor of IEEE Transactions on Microwave Theory and Techniques, Associate Editor of IEEE Transactions on Materials for Electron Devices, Guest Editor of Proceedings of the IEEE (Special Session in Additively Manufactured Electronic Components in Multi-Material 3D and 4D Printing) and Area Editor of Microwave Optical Technology Letters. He is the current Chair of the IEEE NSW AP-S/MTT-S Joint Chapter, Founder and Chair of IEEE MTT-S Technical Committee Microwave Materials and Processing Technologies, Vice Chair of IEEE MTT-S Education Committee and Vice Chair of IEEE NSW Electron Device Society.