Abstract: EDS Webinar: Hybrid Systems-in-Foil: Enabler of Flexible Electronics

Flexible electronics add mechanical flexibility, shape adaptivity and stretchability as well as large-area place ability to electronic systems, thus allowing for conquering fundamentally new markets in consumer and commercial applications. Hybrid assembly of large-area devices and ultra-thin silicon chips on flexible substrates is viewed as an enabler to high-performance and reliable industrial solutions as well as to high-end consumer applications of flexible electronics. This talk discusses issues in ultra-thin chip fabrication, device modeling and circuit design, as well as assembly and interconnects for thin chips embedded into foil substrates in which flexible large-area components are implemented for an overall optimized Hybrid System-in-Foil (HySiF).