Editor-in-Chief and Editors

Gianluca Boselli completed his Master in EE at the University of Parma, Italy, in 1996. In 2001 he completed his Ph.D. at the University of Twente, The Netherlands, where he worked on high current phenomena in CMOS components. In 2001 he joined Texas Instruments, Dallas, Texas, where he focused on ESD and Latch-up development for advanced CMOS technologies, with particular emphasis on process and modeling aspects. In 2007 his responsibilities extended into ESD development of Texas Instruments’ Analog technologies portfolio. He authored several papers in the area of ESD and Latch-up. He presented his work at major conferences, including EOS/ESD Symposium, IEDM, and IRPS. He also presented many invited tutorials and papers at various conferences, including EOS/ESD Symposium, IRPS, IEDM, ESREF, IEW and RCJ. Dr. Boselli has been the recipient of the “Best Paper Award” on behalf of Microelectronics Reliability Journal in 2000. He received “The Best Paper Award” at the EOS/ESD Symposium 2002. He also received the “Outstanding Symposium Award” at the EOS/ESD Symposium in 2002, 2006 and 2010. Dr. Boselli served multiple times as Sub-Committee Chair for Technical Program Committees (TPC) of EOS/ESD Symposium, IRPS, IEW and ESREF. He served as moderator and panelist in many workshops in ESD and Latch-up area. Dr. Boselli has served as TPC Chair at the EOS/ESD Symposium 2006, Vice-General Chair at the EOS/ESD Symposium 2007 and General Chair at the EOS/ESD Symposium 2008. He is currently a member of the Board of Directors of the ESD Association, where he is the Symposium Business Unit Manager. Dr. Boselli is an IEEE senior member and holds fourteen patents with several pending.

Prof. Fang was born in Taipei, Taiwan. He has been working in the MEMS field for 20 years. He received his Ph.D. degree from Carnegie Mellon University (Pittsburgh, PA) in 1995. His doctoral research focused on the determining of the mechanical properties of thin films using MEMS structures. In 1995, he worked as a postdoctoral research for LIGA project at Synchrotron Radiation Research Center, Taiwan. He joined the Power Mechanical Engineering Department at the National Tsing Hua University (Taiwan) in 1996, where he is now a Professor as well as a faculty of NEMS Institute. From June to September 1999, he was at California Inst. of Tech. as a visiting associate. He has established a world-class MEMS testing and characterization lab. His research interests include MEMS with emphasis on micro physical sensors and actuators, micro fabrication/packaging technologies, CMOS MEMS, micro optical systems, and characterization of thin film mechanical properties. Prof. Fang has published more than 110 SCI journal papers, near 180 international conference papers, and 60 patents (all in MEMS field). He is now the Board Member of JMM (SCI journal), and the Associate Editor of IEEE Sensors J., JM3 (SCI journals) and JSTS (J. of Semiconductor Tech. and Science, published by the IEE of Korea). He has served as the chief delegate of Taiwan for World Micromachine Summit since 2008. He also served as the TPC (Technical program committee) of IEEE MEMS’04, MEMS’07, and MEMS’10, the TPC of Transducers’07, and the EPC of Transducers’09 and Transducers’11. He has become the member of international steering committee of Transducers from 2009. He serves as the Asia Regional Program Co-Chair of IEEE Sensors 2010, and the TPC Chair of IEEE NEMS 2011. He also serves as the Steering Committee for APCOT (Asia Pacific Conf. on Transducers) from 2008-2012, and the TPC Co-chair for APCOT 2008. There are 26 PhD and 60 Master students graduated from Prof. Fang’s group so far. Most of them are working in the MEMS and micro sensors related companies, such as TSMC, UMC, ADI, InvenSense, Qualcomm, APM, tMt, Sitronix, PixArt, Domintech, WindTop, etc. He is now the MEMS committee member of SEMI Taiwan. He is the standing committee member of the Nanotechnology and Micro System Association (NMA), Taiwan. He also serves as the chair of the Technology Development and the International Collaboration Committee in NMA. Moreover, Prof. Fang serves as the technical consultant for many MEMS companies in Taiwan.

Dr. Martin Gall is currently department head of Materials and Reliability for Micro- and Nanoelectronics at the Fraunhofer Institute for Nondestructive Testing in Dresden, Germany (FhG IZFP-D). He received the title of Diplomphysiker (M.S. in physics) from the Rheinisch-Westfaelische Technische Hochschule Aachen, Germany, in 1992, and a Ph.D. in materials science and engineering from The University of Texas at Austin, USA, in 1999. He joined the Motorola Semiconductor Division (later to become Freescale Semiconductor) in 1995 as an engineer and has since been working in the area of backend reliability, mainly addressing issues with electromigration, stress-induced voiding, and time-dependent dielectric breakdown. From 2002 until 2009, he managed the interconnect reliability team in Freescale Semiconductor’s Technology Solutions Organization, mainly focusing on implementation of advanced, low-k dielectrics in the 65, 45, 32 and 22 nm nodes. From 2007 until 2009, he was assigned to the IBM/Freescale Semiconductor Technology Alliance in Yorktown Heights and Hopewell Junction, NY. He relocated back to Europe in 2010 to join GLOBALFOUNDRIES, Dresden, Germany, and subsequently the Fraunhofer Institute in 2011.

Agis A. Iliadis (M’83–SM’01) received his MS and PhD degrees in Electrical and Electronic Engineering from the Department of Electrical Engineering and Electronics, University of Manchester Institute of Science and Technology (UMIST), Manchester, U.K. He is a Professor in the Department of Electrical and Computer Engineering, the Director of the Semiconductor Nanotechnology Research Laboratory, and a member of the Maryland NanoCenter, of the University of Maryland, College Park, Maryland, USA. He is a member of the IEEE Electron Device Society and IEEE Reliability Society, a Distinguished Lecturer of the IEEE Electron Device Society, an Ad-Com member of the IEEE EDS Educational Activities Committee, and the Chair of the IEEE-EDS Master and PhD Student Fellowship Committee. He has served as an Ad-Com member of the IEEE-EDS Technical Committee on Electronic Materials, and was the EDS Representative of the IEEE-USA Professional Activities Board (PACE). He is also a member of the Society of Photonic and Instrumentation Engineers (SPIE), and the Institute of Physics (U.K.). He has organized and served in several Conference Committees. His contributions and research interests focus on improving performance and reliability of electronic devices and materials, including ohmic and Schottky metallizations in III-V and wide band gap semiconductors, the development of metal-oxide semiconductor nanostructures like ZnO through self-assembly and thin films through pulsed laser deposition on Si and other substrates, nanostructured chemical sensors, surface acoustic wave (SAW) bio sensors, and the effects of electromagnetic interference on CMOS ICs.

Chee Wee Liu (M’99–SM’00) received the B.S. and M.S. degrees in electrical engineering from the National Taiwan University (NTU), Taipei, Taiwan, in 1985 and 1987, respectively, and the Ph.D. degree in electrical engineering from Princeton University, Princeton, NJ, in 1994. /Vs at low temperature. He was the IEDM TPC member in 2008-2009 and subcommittee chair (SSN) in 2010. He received 2003-2005 Outstanding Research Award, National Science Council, Taiwan. Details in http://nanosioe.ee.ntu.edu.tw

Albert Wang is a Professor of Electrical and Computer Engineering at the University of California, Riverside, California, USA. He currently serves as a Program Director of National Science Foundation, USA. His research interests cover semiconductor devices, AMS/RF ICs, integrated design-for-reliability, 3D heterogeneous devices and integration, emerging nano devices and circuits. He authored 1 book and more than 280 papers, and holds 16 US patents. He was President for IEEE Electron Devices Society (2014-2015). His editorial services include IEEE Electron Device Letters, IEEE Transactions on Circuits and Systems I, IEEE Transactions on Circuits and Systems II, IEEE Journal of Solid-State Circuits, IEEE Transactions on Electron Devices and IET Journal of Engineering. He has been an IEEE Distinguished Lecturer for IEEE Electron Devices Society, IEEE Solid-State Circuits Society and IEEE Circuits and Systems Society. He served on ITRS committee, IEEE 5G Initiative committee and IEEE Fellow Committee. He was General Chair (2016) for IEEE RFIC Symposium and is General Chair (2021) for IEEE EDTM conference. He is Fellow of National Academy of Inventors, Fellow of IEEE Fellow and Fellow of AAAS.