Lastest Issue: Table of Contents (TOC)
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- Table of Contents
- IEEE Transactions on Device and Materials Reliability Publication Information
- Degradation and Reliability Modeling of EM Robustness of Voltage Regulators Based on ADT: An Approach and a Case Study
- A Comprehensive Evaluation of Time-Dependent Dielectric Breakdown of CuAl₂ on SiO₂ for Advanced Interconnect Application
- Characterization, Analysis, and Modeling of Long-Term RF Reliability and Degradation of SiGe HBTs for High Power Density Applications
- Self-Heating Mapping of the Experimental Device and Its Optimization in Advance Sub-5 nm Node Junctionless Multi-Nanowire FETs
- Investigation of the Long-Term Reliability of a Velostat-Based Flexible Pressure Sensor Array for 210 Days
- PEAR: Unbalanced Inter-Page Errors Aware Read Scheme for Latency-Efficient 3-D NAND Flash
- Side-Channel Attack Resilient RHBD 12T SRAM Cell for Secure Nuclear Environment
- Utilizing Two Three-Transistor Structures for Designing Radiation Hardened Circuits
- Reliability and Optimization Simulation Study of Zero-Temperature-Delay Point in Digital Circuits for Advanced Technology
- Analyzing Total-Ionizing-Dose Induced Memory Window Degradation in Ferroelectric FinFET
- Detection and Analysis of Stress Wave in MOSFET Under Gate-Source Overvoltage Failure
- Investigation on Electrical Properties of Printed Graphene Subjected to Aging, Ambient Environment and Gamma Radiation
- A Source Segmented LDMOS Structure for Improving Single Event Burnout Tolerance Based on High-Voltage BCD Process
- Data-Driven Stress/Warpage Analyses Based on Stoney Equation for Packaging Applications
- Characterization and Modeling of Hot Carrier Degradation Under Dynamic Operation Voltage
- Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance
- Power Cycling Modeling and Lifetime Evaluation of SiC Power MOSFET Module Using a Modified Physical Lifetime Model
- Call for Nominations Editor-in-Chief IEEE Transactions on Device and Materials Reliability
- Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers
- TechRxiv: Share Your Preprint Research with the World!
- IEEE Transactions on Device and Materials Reliability Information for Authors
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