Lastest Issue: Table of Contents (TOC)
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- Table of contents
- IEEE Transactions on Device and MaterialsReliability publication information
- A First-Principles Study of the SF6 Decomposed Products Adsorbed Over Defective WS2 Monolayer as Promising Gas Sensing Device
- Power Module Interconnection Reliability in BTS Applications
- Impact of Electrical Stress on
$gamma$ - Online Estimation of the Junction Temperature Based on the Gate Pre-Threshold Voltage in High-Power IGBT Modules
- Identifying the Traps in the Channel Region in GaN-Based HEMTs Using a Nonmonotone Drain Current Transient
- Design Rules for TSV Membranes
- Extended Methodologies for Using Extreme Value Statistic for SRAM Vmin
- Realization of Microfluidic Paper-Based Analytical Devices Using a 3-D Printer: Characterization and Optimization
- Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates
- Modeling and Analysis of Electro-Thermal Impact of Crosstalk Induced Gate Oxide Reliability in Pristine and Intercalation Doped MLGNR Interconnects
- Impacts of Process Variations and Aging on Lifetime Reliability of Flip-Flops: A Comparative Analysis
- Thermal Management for Portable Electronics Using a Piezoelectric Micro-Blower
- Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration
- Performance Analysis and Thermal Reliability Study of Multilayer Organic Solar Cells
- IEEE Transactions on Device and Materials Reliabilityinformation for authors
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